| 加工能力 |
| 层数(Layers) | 1-22(层)Layers |
| 最大加工面积(Max.Board Size) | 500*640mm |
| 板厚(Board Thickness) | 0.4-6.0mm |
| 最小线宽(Min.Line Width) | 0.15mm |
| 最小间距(Min.Space) | 0.15mm |
| 最小孔径(Min.Hole Size) | 0.15mm |
| 孔壁铜厚(PTH Wall Thickness) | >0.025mm |
| 金属化孔径公差(PTH Hole Dia.Tolerance) | ±0.05mm |
| 非金属化孔径公差(Non PTH Hole Dia.Tolerance) | ±0.05mm |
| 孔位公差(Hole Position Deviation) | ±0.076mm |
| 外形尺寸公差(Outline Tolerance) | ±0.1mm |
| 开槽(V-cut) | 30°/45°/60° |
| 最小BGA焊盘(Min.BGA PAD) | 14mil |
| PCB交流阻抗控制(Impedance control PCB) | ≤50Ω ±5Ω |
| ＞50Ω ±10% |
| 阻焊层最小桥宽(Soldemask Layer Min.Bridge width) | 5mil |
| 阻焊膜最小厚宽(Soldemask film Min.Thickness) | 10mil |
| 绝缘电阻(Insulation Resistance) | 1012Ω(常态)Normal |
| 抗剥强度(Peel-off Strength) | 1.4N/mm |
| 阻焊剂硬度(Soldemask Abrasion) | >5H |
| 热衡击测试(Soldexability Test) | 260℃20(秒)second |
| 通断测试电压(E-test Voltage) | 50-250V |
| 介质常数(Permitivity) | ε=2.1~10.0 |
| 体积电阻(Volume resistance) | 1014Ω-m,ASTM D257,IEC60093 |